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Products |
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Location：Products>>Insulation panels>>Applications>>mechanical equipment |
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- Name：IC packaging mold and COG equipment insulation panels
- Number：1
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Description |
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One, made of glass fiber and high heat resistance synthetic resin composition does not contain harmful asbestos.
Two characteristics: high mechanical and dielectric properties, good heat resistance and moisture resistance, good workability. High temperature up to 200-260 degrees, high flatness, high-performance compressive and flexural strength, low thermal conductivity, excellent moisture and chemical resistance.
Third, the high temperature, low thermal expansion
Purposes: IC packaging mold, semiconductor packaging equipment, the COG equipment
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