Japan daisho fiberboard  is a high heat-resistant resin material developed for lead-free reflow furnace, specifications for 1220 * 1020mm, 295 * 495mm thickness 1.6,2,2.5,3 mm, color black, can effectively prevent electrostaticgood machining properties, high temperature, reflow soldering, the frequency of use is much higher than other materials.
 Purposes:
1) FPC / thin plate PCB assembly removal tool of the printed wiring
2) fpc, cof, ccd, cmos assembly → reflow soldering carrier
3) the FPC reinforcing plate, deviation

Features:
1) anti-static, high heat.
2) Surface magical resin viscosity can be divided into high, medium and low
3) processing performance: can be slotting, drilling, milling parallel machining.
4) Durability: Reflow Oven 10,000 cycles.
5) thermal conductivity is very low, difficult to endothermic and can replace synthetic stone and aluminum fixture materials.