First, is mainly used for
A soft board component placement process: FPC SMT
B is thin and soft small hard board mount process: the Rigid the FPCB SMT
C flexible strip mount process: LED SMT
D with a thin soft-LCD manufacturing process
The Flip chip process
F Other bond process
Second, product characteristics:
1, the stability of the high temperature of 250 ℃, long-term use, no distortion, does not produce wrinkles, overweight long-term force the paste
2 there will be no residue in FPC or fixture surface
3 re-use, long life (clean SMT process, properly maintained, use can be> 500 times)
4 easy to clean - isopropyl alcohol IPA or alcohol may be
5 a uniform thickness, keep the surface smooth in the high-temperature use
6 Viscosity can be customized: Usually medium or low
7 in accordance with the fixtures the shape of the punch or scissors molding
8 does not require PI high temperature plastic, cost
9 easy to affix to use, easy to clean
10 appearance can be customized